HiSilicon has dominated the top of the charts since I have found that its results can be very inconsistent, so I takeĮverything with a grain of salt. Hisilicon Kirin 820 – 1 big core (improves AIĪi Benchmarks is the only relatively useful tool forĬomparison.Way to compare that is against benchmarks AIĬomparing the specification of AI is hard too, often it is Qualcomm do their own thing with the Adreno 620, so the only The Kirin 820 should easily outperform the Dimensity 800. The MP number stands for the number of cores/processors so Whereas the Mali G76 on the Samsung is a flagship GPU but a Promises a 30% boost in performance, energy efficiency and silicon density The Arm Mali G57 is the latest mid-range Valhall based GPU which So the Dimensity 1000l looks like a flagship chipset again MediaTek Dimensity 1000l – Mali-G77 MP9.With the GPU, comparisons are a little harder but each So on paper, Qualcomm, which will be the most popularĬhipset out of all the above, is the worst specced. Then the Samsung Exynos 980 uses the more advanced A77 cores 4 x Arm Cortex-A55 cores at 1.8 GHz (Kryo 475.1 x Arm Cortex-A76 cores at 2.2GHz (Kryo 475.1 x Arm Cortex-A76 core at 2.4GHz (Kryo 475.Then the Qualcomm Snapdragon 765G adopts a more common Has the highest specification, and at this point, I am wondering if this is theĪctual flagship from MediaTek, as there have been no announcements for the Out of all the mid-range 5G chipsets, the Dimensity 1000l The closest competitor would be the Dimensity 800 you get: However, Hisilicon (and MediaTek) have bucked this trend andĪdopted a flagship-esque style of 4×4, or technically 1x3x4 for the Kirin 820. Typically most mid-range chipsets adopt some form of 2×6 I had hoped Hisilicon would use the Arm Coretex A77 cores, however Performance from the Kirin 820 putting it up against flagship chipsets from The one exception to the 7NM fabrication process is theīenchmarks were leaked the other day showing a very impressive ![]() The current Kirin 810 usesĪn N7 process, and it is possible the new chipset may use N7P. Manufacturing ProcessĪll the chipsets are manufactured on the 7nm fabrication process,īut the specifics of the process have no been revealed. So if you are not interested in 5G then 4G alternatives will likely save you Yet, so far the 5G functionality has increased the cost of phones considerably, While the Kirin 820 doesn’t make the 810 obsolete Situation where the EU and UK have only just had a phone with the Kirin 810 in With the current disputes with the US, we are in a weird ![]() This is the first phone to feature the new Hisilicon Kirin 820 chipset, with its 5G connectivity this is positioned against the Qualcomm Snapdragon 765G, MediaTek Dimensity 8l. In terms of multimedia, A13 Bionic has Yes, Neural Engine NPU with storage type as NVMe and A9 has No NPU and NVMe storage type.Yesterday Honor took the wraps off their latest upper-mid range phone in China, the Honor 30S. Multimedia and Connectivity Comparison: A13 Bionic vs A9 A larger cache time leads to faster performance. Former one has 6 core and 2660 MHz frequency and latter has 2 cores and 1850 MHz frequency. A13 Bionic comes up with the architecture of undefined and A9 comes up with architecture of Rogue. CPU Comparison: A13 Bionic vs A9ĬPU speed shows how many processing cycles per second can be executed by a CPU. A13 Bionic has an AnTuTu benchmark score of 526466 points with CPU, GPU, Memory, UX score 158367, 218423, 65604, 80367 respectively. Geekbench is a benchmark that measures a processor's single core performance and AnTuTu score is the most popular and trustable benchmarking score which evaluates multi core performance. ![]() Check out detailed comparison with key specs below: Benchmark Comparison: A13 Bionic vs A9īenchmark measures the performance of the CPU. Apple A13 Bionic has been announced on September 2019 whereas Apple A9 has been announced on September 2015.
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